Wafer Separating Table

The wafer separation machine is used to increase the spacing between wafers that have been cut to specific dimensions in the wafer cutting units.

Technical Specifications of the Product Product Advantages

It is used to separate wafers that have been cut to specific dimensions in wafer cutting machines.
Metal surfaces in contact with the product are manufactured from 304-grade stainless steel
Wafers coming from the wafer cutting machines are spaced out using separators located on the wafer separation table.
The separation of wafers on the table ensures more effective and efficient operation of the subsequent coating and packaging machines.

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